ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,199, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Giseu... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,200, issued on Aug. 25, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,201, issued on Aug. 25, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package having the same"... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,202, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Deformable semiconductor device connection" was invented by Onu... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,203, issued on Aug. 25. "Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps" was... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,204, issued on Aug. 25, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method for manufacturing a package st... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,205, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Solder reflow apparatus and method of manufa... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,206, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-chu, Taiwan). "Bump-on-trace design for enlarge b... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,207, issued on Aug. 25, was assigned to HITACHI POWER SEMICONDUCTOR DEVICE LTD. (Ibaraki, Japan). "Semiconductor device including semicondu... और पढ़ें
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,208, issued on Aug. 25, was assigned to Nippon Micrometal Corp. (Saitama, Japan). "Bonding wire for semiconductor devices" was invented by ... और पढ़ें